Numerical modelling of scanned beam laser soldering of fine pitch packages

Abstract

Laser soldering provides a useful tool for the electronics manufacturer and has found a number of successful industrial applications. The laser provides highly controllable localised heating in a manner similar to hand soldering and has distinct advantages over other soldering methods. However, the heating processes that occur in laser soldering are complex making it difficult to predict whether a particular operation will be successful. Numerical modelling provides a valuable tool in answering such questions but the modelling process and the assumptions upon which it is based must be understood if the results are to be reliable.This paper explains the assumptions made in deriving a suitable model and describes the use of a commercial finite element modelling package to aid the understanding of laser soldering processes, with a particular emphasis on single and multi‐pass scanned beam soldering operations.