Quality and Reliability Engineering International · 2003 · 140 citations · 8 references
EngineeringElectrical EngineeringMaterials EngineeringAgingElectronic MaterialsMicroelectronicsDevice ReliabilityFailure Mode AnalysisFailure TheoriesReliabilityReliability ModelingSemiconductor ReliabilityAging Degradation AnalysisCatastrophic EventsDegradationFailure Mode AssessmentFailure ModesFracture Failure ModesProbabilistic Reliability AnalysisProbabilistic Reliability Modeling
The study extends reliability analysis of electronic devices with multiple competing failure modes, incorporating performance aging degradation. The authors derive the probability of failure for each mode, illustrate it with a two‑mode example (solder/Cu pad fracture and light‑intensity degradation), and perform reliability modeling of individual modes and overall device reliability. Using the derived probabilities, the dominant failure mode can be predicted, and the reliability modeling demonstrates how individual mode analysis informs overall device reliability. © 2003 John Wiley & Sons, Ltd.
Abstract This paper presents an extension of reliability analysis of electronic devices with multiple competing failure modes involving performance aging degradation. The probability that a product fails on a specific mode is derived. Using this probability, the dominant failure mode on the product can be predicted. A practical example is presented to analyze an electronic device with two kinds of major failure modes–solder/Cu pad interface fracture (a catastrophic failure) and light intensity degradation (a degradation failure). Reliability modeling of an individual failure mode and device reliability analysis is presented and results are discussed. Copyright © 2003 John Wiley & Sons, Ltd.
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