Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials - Concepedia

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Influence of thermal cycles on the silylation process for recovering k-value and chemical structure of plasma damaged ultra-low-k materials

11

Citations

5

References

2011

Year

Tobias Fischer, Nicole Ahner, Sven Zimmermann, Stefan E. Schulz

Microelectronic Engineering

Materials ScienceEngineeringSilylation ProcessLaser-induced BreakdownThermal CyclesFusion Reactor MaterialChemistryNonthermal PlasmaUltra-low-k MaterialsChemical KineticsPlasma ProcessingPlasma ApplicationMicrostructure

References

	Year	Citations

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