IEEE Photonics Technology Letters · 2008 · 17 citations · 7 references
EngineeringOptoelectronic DevicesPhotosensitive Epoxy ResinsPolymer ProcessingLight-emitting DiodesActive Packaging MethodPhotopolymer NetworkElectronic PackagingPackaging ParametersPolymer ChemistryMaterials SciencePhotonicsElectrical EngineeringOptoelectronic MaterialsNew Lighting TechnologyLight CuringActive Packaging ProcessOptoelectronicsAdvanced PackagingWhite OledSolid-state LightingApplied PhysicsLed ChipLight-emitting Diode LampsOptical Devices
<para xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> A novel active light-emitting diode (LED) packaging method is presented. Our method utilizes the emission from the LED chip itself to package the LED with photosensitive epoxy. Such a photon-induced polymerization method, leading to the formation of specific lamp shapes and characteristics, eliminates the utilization of the mold. By controlling the packaging parameters, for example, the polymerization current and the polymerization time, the emission properties of the LED lamps can be controlled. It is found that the self-focusing effect plays an important role in the active packaging process. </para>
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