IEEE Electron Device Letters · 2008 · 59 citations · 7 references
EngineeringElectrical EngineeringMicroelectronicsNanotechnologySemiconductor DevicesDevice CharacterizationHigh-frequency Semiconductor DevicesMicrowave MeasurementsMicrowave Semiconductor DevicesShort-channel EffectsThermal Properties Of SemiconductorsHigh-frequency CharacterizationHigh-frequency ElectronicsHigh-frequency PerformanceHigh-temperature Device OperationLow-temperature PerformanceMetal-oxide-semiconductor Field-effect Transistor ModelingMicrowave TransistorsThermal Effects In Microwave Devices
RF characteristics of a nanoscale MOSFET are measured and analyzed at temperatures ranging from 4.2 to 300 K for deep-space RF applications. This device shows a 197-GHz current gain cutoff frequency (f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> ) and a 162-GHz maximum oscillation frequency (f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> ) when operating at liquid-helium temperature, which represent a 60% and 80% improvement compared to room temperature performances, respectively, f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">T</sub> continually improves as the temperature decreases to near-liquid-helium temperature due to the decrease of gate capacitance (C <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">gg</sub> ). f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> decreases as the temperature is lowered below 25 K due to the increase of gate resistance (R <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">g</sub> ).
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MOS transistor modeling for RF IC design
Christian Enz, Yuhua Cheng · IEEE Journal of Solid-State Circuits · 2000 · 280 citations · Full text