Alloy development for highly conductive thermal management materials using copper-diamond composites fabricated by field assisted sintering technology

Sintering activation by external electrical field

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Interfacial design of Cu-based composites prepared by powder metallurgy for heat sink applications

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Advances in composite materials for thermal management in electronic packaging

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Engineering, Materials Engineering, Materials Science +16

Enhanced thermal conductivity in copper matrix composites reinforced with titanium-coated diamond particles

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Review of Cooling Technologies for Computer Products

Richard C. Chu, Robert E. Simons, Michael Ellsworth et al. · IEEE Transactions on Device and Materials Reliability · 2004 · 252 citations

Engineering, Computer Engineering, Computer Systems +17