High density 256-channel chip integration with flexible parylene pocket

Abstract

Current state-of-the-art technologies for retinal prosthetics suffer greatly from complicated IC packaging with high lead count because there is the lack of high density and high lead-count connection. To overcome this challenge, we develop here a packaging technique that utilizes a flexible parylene pocket with metal pads to house a chip for aligned connection. This reported pocket can be designed with the right size to house any IC chip and/or a discrete component. As a demonstration, a 256-channel conduction chip along with an RFID chip have been connected and tested with this technique. The results show that this new technique can be further improved to achieve 10,000 connections within an area of 1 cm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .