A SiC MEMS Resonant Strain Sensor for Harsh Environment Applications

Abstract

In this paper, we present a silicon carbide MEMS resonant strain sensor for harsh environment applications. The sensor is a balanced-mass double-ended tuning fork (BDETF) fabricated from 3C-SiC deposited on a silicon substrate. The SiC was etched in a plasma etch chamber using a silicon oxide mask, achieving a selectivity of 5:1 and etch rate of 2500 Aring/min. The device resonates at atmospheric pressure and operates from room temperature to above 300degC. The device was also subjected to 10 000 g shock (out-of-plane) without damage or shift in resonant frequency. The BDETF exhibits a strain sensitivity of 66 Hz/muepsiv and achieves a strain resolution of 0.11 muepsiv in a bandwidth from 10 to 20 kHz, comparable to state-of-the-art silicon sensors