Effects of Ramp-Time on the Thermal-Fatigue Life of SnAgCu Lead-Free Solder Joints

Abstract

The effects of temperature-cycling ramp-time on the thermal-fatigue life of lead-free solder joints are investigated in this study. Emphasis is placed on the determination of creep responses and the creep strain energy density per cycle of a PBGA (plastic ball grid array) package’s (SnAgCu) leadfree solder joints on a FR-4 printed circuit board (PCB) subjected to various ramp times (0.5, 1, 5, 10, and 15 minutes) for two different ranges of cycling temperatures, namely, from 0 o C to 100 o C and from -25 o C to 125 o C. For all