Millimeter-wave monolithic integrated circuit interconnects using electromagnetic field coupling

Abstract

Standard interconnect and packaging techniques for millimeter-wave monolithic integrated circuits (MIMIC's) tend to get more and more difficult at millimeter-wave frequencies due to the increased influence of discontinuities and tolerances, especially in conjunction with temperature and hermetic sealing. To overcome these problems, a novel concept is proposed based on electromagnetic field coupling. On this basis, coupling structures for feed-throughs out of a package as well as chip interconnects have been designed, fabricated, and tested in a scaled frequency range and in the original millimeter-wave frequency range showing good results with acceptable tolerance requirements.