IEEE Electron Device Letters · 2005 · 142 citations · 10 references
EngineeringElectrical EngineeringElectronic MaterialsMicroelectronicsSemiconductor DevicesHigh-frequency Semiconductor DevicesMetal-semiconductor ContactsMicrowave Semiconductor DevicesSemiconductor DetectorsWide-bandgap Semiconductor DevicesFoundry ProcessesJunction Leakage CurrentLeakageReverse Bias CharacteristicsSchottky Barrier ContactsSchottky Barrier DiodesSchottky BarriersSchottky Contacts
CoSi <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> -Si Schottky barrier diodes on an n-well and on a p-well/substrate are fabricated without a guard ring in a 130-nm foundry CMOS process. The nand p-type diodes with an area of 16×0.32×0.32 μm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> achieve cutoff frequencies of /spl sim/1.5 and /spl sim/1.2 THz at 0-V bias, respectively. These are the highest cutoff frequencies for Schottky diodes fabricated in foundry silicon processes. The leakage currents at 1.0-V reverse bias vary between 0.4 to 10 nA for the n-type diodes. The break down voltage for these diodes is around 15 V. It should be possible to use these in millimeter wave and far infrared detection.
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Physics of semiconductor devices
Choice Reviews Online · 1990 · 1.4K citations
<i>Physics of Semiconductor Devices</i>
M. S. Shur, Jasprit Singh · Physics Today · 1990 · 92 citations