Removal of Ion-Implanted Photoresists Using Atomic Hydrogen

Abstract

In this paper, we investigated the removal characteristic of positive-tone novolak photoresists into which B, P, and As ions were implanted with doses of at an acceleration energy of 70 keV using atomic hydrogen, and the hardening mechanisms for the photoresists. All of the ion-implanted photoresists with doses up to were removed without regard for ion species. The removal rates of the photoresists decreased with increasing ion-implantation dose due to hardening of the photoresist surfaces with implantation. The thickness of the surface-hardened layer of the photoresists decreased in the order of , and the removal rate increased with decreasing thickness. The energy supplied from the ions to the photoresist concentrated on the surface side in the order of , and the impact of the heavier ion on the photoresist was greater than that of the lighter ion. We deduced that the photoresists exhibited carbonization and cross-linkage attributable to the decrease in OH, CH, and O 1s and the increase in , C 1s, and π-conjugated systems.