Publication | Closed Access
Microtexture and Strain in Electroplated Copper Interconnects
17
Citations
7
References
2000
Year
Materials ScienceElectromigration TechniqueEngineeringMicrofabricationMechanical EngineeringInterconnect (Integrated Circuits)Electroplated Copper InterconnectsSolid MechanicsHigh Strain RateElectronic PackagingMechanics Of MaterialsMicrostructureElectrical Insulation
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