Millimeter-Wave Passives in 45-nm Digital CMOS

Abstract

With dramatically increased f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">t</sub> and f <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">max</sub> , CMOS technologies have been widely applied in the design of millimeterwave circuits. To reduce the fabrication cost, digital CMOS processes may be used. Due to the lack of thick top metal and the reduced distance between the top metal and silicon substrates in a digital CMOS, the design of high-performance passives becomes very challenging, particularly in the millimeter-wave frequency regime. In this letter, passives with novel structures were fabricated in a 45-nm digital CMOS process. These passives, including transmission lines, spiral inductors, and metal-oxide-metal (MOM) capacitors, were designed and characterized up to 110 GHz. Their performance was compared with those fabricated using 180- and 90-nm RF CMOS processes. These passives achieved good performance in the millimeter-wave regime. A MOM capacitor has a self-resonant frequency higher than 110 GHz. An inductor achieves a quality factor of 24 at 70 GHz. These results show the feasibility of implementing the millimeterwave passives and systems in a 45-nm digital CMOS process.