Publication | Closed Access
Ultramicro fabrications on Fe-Ni alloys using electron-beam writing and reactive-ion etching
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Citations
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References
1996
Year
EngineeringElectron-beam LithographyFe-ni AlloysPlasma ProcessingMetal ProcessingAnisotropic EtchingChemical EngineeringNanolithography MethodThin Film ProcessingMaterials EngineeringMaterials ScienceHigh-resolution Electron-beam WritingElectron-beam WritingMicroelectronicsPlasma EtchingMicrostructureMicrofabricationSurface ScienceApplied PhysicsAlloy DesignReactive-ion EtchingNovel Reactive-ion-etching
A novel reactive-ion-etching (RIE) method useful for ferromagnetic material of Permalloy (80%Ni-4.5%Mo-Fe) has been developed. This method involves rf plasma of a gas mixture NH/sub 3/-CO aimed at the formation of volatile transition metal carbonyls. A maximum etching rate of 35 nm/min and highly anisotropic etching was obtained. The etching selectivity ratios of Permalloy to SiO/sub 2/ or Si were about 10 or 4, respectively. High-resolution electron-beam writing was followed by the RIE process on the Permalloy films. To achieve high-resolution electron-beam writing, amorphous carbon film was placed between the resist layer and SiO/sub 2/ film overlaid on the Permalloy film. By this method, nanostructures of Permalloy stripes of 200 nm lines and 300 nm spaces with clear-cut features were fabricated.
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