Some recent developments in the MOCVD and ALD of high-κ dielectric oxides

Abstract

A range of high-permittivity (κ) dielectric oxides are currently being investigated as alternatives to SiO2 as the dielectric insulating layer in sub-0.1 μm CMOS technology. Metalorganic chemical vapour deposition (MOCVD) and atomic layer deposition (ALD) are promising techniques for the deposition of these high-κ dielectric oxides. Some recent developments in precursors for the MOCVD and ALD of ZrO2, HfO2, Zr- and Hf-silicate and the rare earth oxides M2O3 (M = Pr, La, Gd, Nd) are discussed.