Multi-band RF and mm-wave design solutions for integrated RF functions in liquid crystal polymer system-on-package technology

Abstract

Electronic packaging evolution involves systems, technology and material considerations. In this paper, we present a liquid crystal polymer (LCP) based multilayer packaging technology that is rapidly emerging as an ideal platform for low cost, multi-band and reconfigurable RF front-end module integration. LCP's very low water absorption (0.04%), low cost and high electrical performance makes it very appealing for RF applications. Here we describe main characteristics and real performance of LCP substrate, by means of several design examples. A Single-Input-Single-Output (SISO) dual-band filter operating at ISM 2.4-2.5 GHz and UNII 5.15-5.85 GHz frequency bands, a dual polarization, dual frequency 2/spl times/1 antenna operating at 14 and 35 GHz, and a WLAN IEEE 802.11a compliant compact module (volume of 75/spl times/35/spl times/0.2 mm/sup 3/) have been fabricated on LCP substrate, showing the great potential of the System-On-Package approach for 3D compact, multi-band and reconfigurable integrated RF and millimeter waves functions and modules.