Publication | Open Access
Electrical Characteristics of LaAlO[sub 3] Gate Dielectrics Prepared by High-Pressure Hydrogen Post-Deposition Annealing
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Citations
9
References
2006
Year
Materials ScienceMaterials EngineeringElectrical EngineeringElectrical CharacteristicsPost-deposition AnnealingEngineeringSemiconductor DeviceNanoelectronicsStress-induced Leakage CurrentOxide ElectronicsApplied PhysicsTime-dependent Dielectric BreakdownHigh-pressure HydrogenSemiconductor MaterialSemiconductor Device FabricationHigh-pressure Pda SamplesMicroelectronicsElectrical Insulation
To improve electrical characteristics of high-k gate dielectrics, post-deposition annealing (PDA) was performed in high-pressure pure hydrogen ambient. High-pressure PDA samples show excellent electrical characteristics such as low fixed charge density, and reduced interface state density confirmed by capacitance-voltage analysis and conductance technique, respectively. They also showed no frequency dependency and a hysteresis of . The leakage current decreases remarkably from 0.23 to at the gate voltage of below . The excellent electrical characteristics of high-pressure hydrogen annealed sample can be explained by enhanced hydrogen passivation of defects in high-k dielectric.
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