IEEE Microwave and Guided Wave Letters · 1995 · 21 citations · 4 references
EngineeringElectrical EngineeringMicroelectronicsMicrowave EngineeringSemiconductor DevicesHigh-frequency Semiconductor DevicesIii-v SemiconductorsIntegrated Circuit DesignMicrowave Integrated CircuitsMicrowave Semiconductor DevicesSemiconductor Device MaterialsGaas Microwave Integrated CircuitsGaas Monolithic Microwave Integrated CircuitsMicrowave DevicesMillimeter Wave ArraysMillimeter-wave Integrated CircuitsMonolithic Microwave Integrated Circuit DesignStackingThree-dimensional Integration
A novel masterslice MMIC is presented that expands the possibilities for three-dimensional (or multilayer) MMIC technology. This MMIC incorporates two levels of ground metals, resulting in an effective selection of master-array elements on the wafer surface by using the lower-level metal and a circuit-stacking effect by the upper one. X-band amplifier and receiver MMIC's on 3/spl times/1 and 6/spl times/3 array-units, respectively, are also demonstrated in very small areas.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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Multilayer MMIC using a 3 mu m*3-layer dielectric film structure
T. Tokumitsu, T. Hiraoka, Hiroyuki Nakamoto et al. · 2002 · 93 citations
Multilayer MMIC branch-line coupler and broad-side coupler
Ichihiko Toyoda, Takeshi Hirota, T. Hiraoka et al. · 2003 · 82 citations