Publication | Closed Access
Novel read disturb failure mechanism induced by FLASH cycling
87
Citations
8
References
1993
Year
Unknown Venue
EngineeringLow Failure RateReliability EngineeringNanoelectronicsFailure AnalysisFabrication ProcessElectronic PackagingElectrical EngineeringHardware ReliabilityFlash MemoryComputer EngineeringFlash CyclingSemiconductor Device FabricationMicroelectronicsStress VoltageStress-induced Leakage CurrentApplied PhysicsSemiconductor MemoryElectrical Insulation
The read disturb failure mechanism reported causes unselected erased bits residing on selected wordlines to gain charge under low field conditions, causing them to appear programmed. This failure appears to be due to electron tunneling barrier lowering by positive charge trapped during program/erase cycling. The Si-SiO/sub 2/ barrier in failing bits is reduced from 3.0 eV to under 1.0 eV at 70 degrees C. The FLASH EPROM array failure rate dependence on cycling, stress voltage, temperature, and duty cycle is characterized. A low failure rate has been found for the fabrication process studied. >
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