IEEE Transactions on Advanced Packaging · 2006 · 20 citations · 13 references
EngineeringElectrical EngineeringOpticsOptoelectronicsPhotonicsIntegrated OpticsOptical Communication SystemsOptical FibersPhotonic Integrated CircuitsSemiconductor LasersSilicon PhotonicsCrosstalkFiber-to-chip CouplingIntegrated LasersMisalignment ToleranceOptical Bench DesignOptical PackagingSilicon Photonics For CommunicationsVertical-cavity Surface-emitting Lasers
We propose an advanced structure of optical subassembly (OSA) for packaging of the vertical-cavity surface-emitting laser (VCSEL) array, using (111) facet mirror of the V-groove ends formed in a silicon optical bench (SiOB) and angled fiber apertures. The feature of our OSA can provide a low optical crosstalk between neighboring channels, a low feedback reflection, and a large misalignment tolerance along the V-groove. We describe the optimized design of fiber angle, VCSEL position, and fiber position. The fabricated OSA structure consists of 12 channels of angled fiber array, 54.7deg V-grooves, Au-coated mirrors on (111) end facet of the V-grooves, and flip-chip-bonded VCSEL array on a SiOB. In this structure, the beam emitted from the VCSEL is deflected at the 54.7deg mirror of (111) end facet and propagated into the angled fiber. The angled fiber array was polished by 57deg. Fabricated OSAs showed a coupling efficiency of 30%-50% that is 25 times larger than that obtained from an OSA with a vertically flat fiber array. Our OSA showed large misalignment tolerance of about 90 mum along the longitudinal direction in the V-groove. We fabricated a parallel optical transmitter module using the OSA and demonstrated 12 channels times2.5 Gb/s data transmission with a clear eye diagram
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Yiu-Man Wong, D.J. Muehlner, C.C. Faudskar et al. · Journal of Lightwave Technology · 1995 · 120 citations