CAD for silicon anisotropic etching

Abstract

A computer program that simulates silicon single crystal etching in KOH is proposed. Starting from a two-dimensional mask the program finds the relevant etching planes and delivers a projected three-dimensional output of the etched structure with the etchtime (etchdepth) as parameter. The program is discussed and sample results are shown.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>