Development of wafer level NCF (non conductive film)

Abstract

The wafer level non conductive film (WL-NCF) has been developed, which has dynamic temperature dependence of viscosity. The b-stage WL-NCF was laminated onto the wafer without void, which has 870 Au bumps of 15 mum height and 25 mum pitch. The wafer with the WL-NCF on the surface was cut into chips by standard dicing process. The chip which has the NCF on the surface was bonded onto the ITO wired glass substrate by a flip chip bonder and the electrical connection was confirmed.