IEEE Transactions on Circuits & Systems II Express Briefs · 2008 · 49 citations · 14 references
EngineeringBiomedical EngineeringComputer EngineeringRadiation DetectionRadiation DosimetrySystem-on-chip DesignCmos Circuit DesignRadiation DetectorsRadiation Dose MeasurementRadiation Monitoring SystemsRadiation TherapyRadio-frequency Integrated CircuitsCmos Radio-frequency CircuitsDosimetry Readout SystemsMetal-oxide-semiconductor Field-effect Transistor DosimetryPower ConsumptionSystem-in-packageSystem-on-chip ArchitectureSystem-on-chip IntegrationWireless Radiation Monitoring
A new floating-gate (FG) MOSFET based wireless dosimeter system-in-package (SiP) is presented. This miniature and completely integrated wireless dosimeter SiP comprises a CMOS FG radiation sensor and transmitter (TX) in a low-temperature co-fired ceramic (LTCC) package. The design is very well suited to wireless transmission of radiation sensor data in radiotherapy and to Extra Vehicular Activity Radiation Monitoring (EVARM) in space. Two different solutions, namely system-on-chip (SoC) and SiP, are demonstrated. In the SoC, which is size and power efficient, the TX includes an on-chip loop antenna which also acts as the inductor for the VCO resonant tank circuit. The SiP solution has an LTCC antenna with optimized impedance to conjugate match the TX chip. The radiation sensor demonstrates a measured sensitivity of 5 mV/rad. The SoC module size is only 2 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , consumes 5.3 mW of power and delivers -0.9 dBm of radiated power, sufficient to communicate with a low noise receiver connected to an off-chip patch antenna placed 1.38 m away. The SiP design provides a larger communication range of 75 m at the cost of additional power consumption and size.
14
Antenna theory, analysis, and design
W. Croswell · IRE Transactions on Telemetry and Remote Control · 1982 · 8.6K citations
A compact LTCC-based Ku-band transmitter module
Chang-Ho Lee, A. Sutono, Sangwoo Han et al. · IEEE Transactions on Advanced Packaging · 2002 · 85 citations