Publication | Closed Access
Optimum computation of capacitance coefficients of multilevel interconnecting lines for advanced package
11
Citations
9
References
1989
Year
EngineeringInterconnect (Integrated Circuits)Electromagnetic CompatibilityPhysical Design (Electronics)Advanced Packaging (Semiconductors)Optimum ComputationComputational ElectromagneticsAdvanced PackageElectronic PackagingElectrical EngineeringComputer EngineeringMicroelectronicsTotal Charge DensityMultilayered Dielectric MediumCapacitance CoefficientsDielectric InterfacesChip-scale PackageTransmission LineElectrical Insulation
A general procedure for computing the capacitance coefficients of multilevel interconnections in multilayered dielectric medium is given. The electromagnetic concept of total charge density is applied. It makes it possible to obtain integral equations between scalar potential and charge density distributions. These equations are solved by the method of moments technique. To optimize the computational algorithm, special consideration is given to the limitation of the dimensions of the dielectric interfaces. Simple criteria are introduced to divide the interfaces into an optimum number of elementary parts. Theoretical results thus obtained agree closely with the experimental results from test vehicles.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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