IEEE Photonics Technology Letters · 2007 · 37 citations · 5 references
EngineeringElectrical EngineeringDigital CommunicationOptoelectronicsPhotonicsIntegrated OpticsIntegrated PhotonicsInterconnect DesignOptical Communication SystemsOptical InterconnectsPhotonic Integrated CircuitsChip-to-chip Optical InterconnectsOptical Communication LinksOptical Interconnect ArchitecturesOptical Link DesignOptical PackagingOptical Transmission SystemsThroughput
The demonstration of an optical platform based on an optical printed circuit board (OPCB) was shown for two-dimensional (2-D) chip-to-chip optical interconnection. The optical platform was designed for 96 Gb/s total throughput which was 2 layers times 4 channels times 4 parallel links times 3 Gb/s/ch and using a passive assembly technology. We fabricated three main components for the 2-D optical interconnection; two-layered six-channel fiber- and connector-embedded OPCB, two-layered six-channel 90deg-bent fiber connectors, and 2-D optical transmitter/receiver (Tx/Rx) modules. The total optical loss from the Tx to the Rx was measured to approximately be -5.3 dB. The optical interconnection using an optical platform was successfully achieved with 3-Gb/s/ch data transmission
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Fully SMT-compatible optical-I/O package with microlens array interface
Y. Ishii, N. Tanaka, Tadashi Sakamoto et al. · Journal of Lightwave Technology · 2003 · 42 citations