IEEE Photonics Technology Letters · 2006 · 47 citations · 14 references
EngineeringElectrical EngineeringOptical MaterialsOptoelectronicsPhotonicsFiber-optic CommunicationIntegrated OpticsIntegrated PhotonicsOptical Communication SystemsOptical InterconnectsPhotonic Integrated CircuitsChip-to-chip Optical InterconnectsFiber TechnologyFiber-to-chip CouplingOptical Link DesignOptical Packaging
We propose a passively assembled chip-to-chip optical interconnection system using fiber-optic technology. To demonstrate the system, three components were prepared: a fiber-embedded optical printed-circuit board (OPCB), optical transmitter/receiver modules, and 90/spl deg/-bent fiber connectors. All components were assembled using precise guide pins and holes so that complete passive alignment was achieved in the OPCB. An optical link of 5-Gb/s/ch signals with a total link loss of -1.5 dB has been successfully demonstrated from the assembled system.
14
Fully embedded board-level guided-wave optoelectronic interconnects
R.T. Chen, Lei Lin, Chulchae Choi et al. · Proceedings of the IEEE · 2000 · 202 citations
Engineering, Computer Engineering, Electrical Engineering +17
Linking with light [high-speed optical interconnects]
Nick Savage · IEEE Spectrum · 2002 · 143 citations