The Effect of Metal-Film Thickness on Pattern Formation by Using Direct Imprint

Abstract

This paper presents the use of the three-dimensional (3D) molecular dynamics (MD) simulation to demonstrate the direct imprint behavior between the metallic film and mold. The simulation considers the interaction of the mold and the defect-free metallic film during direct imprint process. The mold and the metallic film are made of nickel and aluminum, respectively, and are arranged in face-centered cubic (fcc) single crystal structures. Different imprint simulation conditions are implemented by changing the thickness of metal film; the formation mechanism, the hydrostatic phenomenon and the stress distribution of the metallic film are investigated. The imprint force applied to the mold, plastic atom ratio, and the formation ratios are calculated during direct imprint process. The relationship between the film thickness and the substrate effect are also investigated.