Publication | Closed Access

Drop-on-demand E-jet printing of continuous interconnects with AC-pulse modulation on highly insulating substrates

Electrical EngineeringEngineeringAc-pulse ModulationDrop-on-demand E-jet PrintingMicrofabricationAdvanced Packaging (Semiconductors)Continuous InterconnectsFabrication TechniquePrinted ElectronicsElectronic PackagingMicroelectronics3D PrintingElectrical Insulation