Chia‐Pin Chiu

Cooling a Microprocessor Chip

Ravi Mahajan, Chia‐Pin Chiu, G. Chrysler · Proceedings of the IEEE · 2006 · 374 citations

Engineering, Computer Engineering, Electrical Engineering +17

Co-Packaged Photonics For High Performance Computing: Status, Challenges And Opportunities

Ravi Mahajan, Xiaoqian Li, Joshua B. Fryman et al. · Journal of Lightwave Technology · 2021 · 152 citations

Engineering, Electrical Engineering, High-performance Computing +17

High-resolution ac-pulse modulated electrohydrodynamic jet printing on highly insulating substrates

Chuang Wei, Hantang Qin, Nakaira A Ramírez-Iglesias et al. · Journal of Micromechanics and Microengineering · 2014 · 108 citations

Engineering, Electrical Engineering, Materials Engineering +13

An accelerated reliability test method to predict thermal grease pump-out in flip-chip applications

Chia‐Pin Chiu, B. Chandran, Kevin Mello et al. · 2002 · 70 citations

Engineering, Electrical Engineering, Materials Engineering +16

Thermal Performance and Key Challenges for Future CPU Cooling Technologies

Ioan Sauciuc, Ravi Prasher, Je-Young Chang et al. · 2005 · 57 citations

Engineering, Computer Engineering, Mechanical Engineering +17