Publication | Closed Access
Surface superlattice formation in silicon inversion layers using 0.2-µm period grating-gate electrodes
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References
1985
Year
Materials ScienceOxide HeterostructuresElectrical EngineeringSemiconductorsSurface SuperlatticeEngineeringInversion Electron DistributionSemiconductor TechnologyOxide ElectronicsSurface ScienceApplied PhysicsOxide SemiconductorsSurface Superlattice FormationSemiconductor Device FabricationX-ray LithographySilicon Inversion LayersSemiconductor Device
Transport has been studied in n-channel metal-oxide-semiconductor field-effect transistors (MOSFET's) in which a 0.2-µm-period tungsten grating, with lines perpendicular to the current flow, was incorporated into the gate. This gate structure, which was fabricated using X-ray lithography and lift-off, produces a controllable periodic modulation of the inversion electron distribution. Low-temperature conductance measurements reveal reproducible structure which is consistent with the formation of a surface superlattice in the inversion layer.
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