The effect of gap size on the microstructure and mechanical properties of the transient liquid phase bonded FSX-414 superalloy

A study of the transient liquid phase bonding process applied to a Ag/Cu/Ag sandwich joint

Isaac Tuah-Poku, M. Dollár, T. B. Massalski · Metallurgical Transactions A · 1988 · 330 citations

Engineering, Materials Engineering, Materials Science +11

Transient liquid phase bonding

William F. Gale, Daniel A. Butts · Science and Technology of Welding & Joining · 2004 · 296 citations

Natural Sciences, Materials Engineering, Materials Science +10

TLP bonding: a new method for joining heat resistant alloys

D. S. Duvall, W.A. Owczarski, D.F. Paulonis · Welding Journal · 1974 · 263 citations

Engineering, Materials Engineering, Materials Science +13

Modelling of transient liquid phase bonding

Y. Zhou, William F. Gale, T. H. North · International Materials Reviews · 1995 · 221 citations

Engineering, Materials Engineering, Materials Science +12

Critical interlayer thickness for transient liquid phase bonding in the Cu–Sn system

Nick Bosco, Frank W. Zok · Acta Materialia · 2004 · 208 citations

Natural Sciences, Materials Engineering, Materials Science +14