Integrated thermal management techniques for high power electronic devices

Cramming More Components Onto Integrated Circuits

Gordon E. Moore · Proceedings of the IEEE · 1998 · 5.8K citations

Engineering, Device Integration, Electronic Design Automation +23

Experimental and numerical study of pressure drop and heat transfer in a single-phase micro-channel heat sink

Weilin Qu, Issam Mudawar · International Journal of Heat and Mass Transfer · 2002 · 981 citations

Numerical Study, Heat Transfer Process, Engineering +9

Heat transfer and pressure drop in fractal tree-like microchannel nets

Yongping Chen, Ping Cheng · International Journal of Heat and Mass Transfer · 2002 · 432 citations

Heat Transfer Process, Engineering, Microfabrication +10

Localized silicon fusion and eutectic bonding for MEMS fabrication and packaging

Yu‐Ting Cheng, Liwei Lin, K. Najafi · Journal of Microelectromechanical Systems · 2000 · 229 citations

Engineering, Mechanical Engineering, Eutectic Bonding +16

MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Cristina H. Amon, Jayathi Y. Murthy, S. C. Yao et al. · Experimental Thermal and Fluid Science · 2001 · 123 citations

Mems-enabled Thermal Management, Integrated Cooling, Electrical Engineering +13