Publication | Closed Access
Stabilization of the cubic phase of HfO2 by Y addition in films grown by metal organic chemical vapor deposition
86
Citations
21
References
2006
Year
Y AdditionHfo2 Thin FilmsEngineeringThin Film Process TechnologyChemistryChemical DepositionMolecular Beam EpitaxyEpitaxial GrowthThin Film ProcessingMaterials EngineeringMaterials ScienceOxide HeterostructuresOxide ElectronicsCubic PhaseElectronic MaterialsYttrium ContentSilicate PhaseSurface ScienceApplied PhysicsThin FilmsChemical Vapor Deposition
Addition of yttrium in HfO2 thin films prepared on silicon by metal organic chemical vapor deposition is investigated in a wide compositional range (2.0–99.5at.%). The cubic structure of HfO2 is stabilized for 6.5at.%. The permittivity is maximum for yttrium content of 6.5–10at.%; in this range, the effective permittivity, which results from the contribution of both the cubic phase and silicate phase, is of 22. These films exhibit low leakage current density (5×10−7A∕cm2 at −1V for a 6.4nm film). The cubic phase is stable upon postdeposition high temperature annealing at 900°C under NH3.
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