Applied Physics Letters · 2006 · 88 citations · 21 references
Natural SciencesMaterials EngineeringMaterials ScienceCondensed Matter PhysicsMaterials ChemistryThin FilmsChemical Vapor DepositionOxide SemiconductorsSemiconductor Device MaterialsSemiconductor PhysicsSemiconductor Thin FilmsAnnealing Temperature EffectsCurrent DensityLeakage CurrentLeakage Current ReductionMetal-organic Chemical Vapor DepositionMetalorganic Chemical Vapor DepositionPermittivityThin Oxide Films
Addition of yttrium in HfO2 thin films prepared on silicon by metal organic chemical vapor deposition is investigated in a wide compositional range (2.0–99.5at.%). The cubic structure of HfO2 is stabilized for 6.5at.%. The permittivity is maximum for yttrium content of 6.5–10at.%; in this range, the effective permittivity, which results from the contribution of both the cubic phase and silicate phase, is of 22. These films exhibit low leakage current density (5×10−7A∕cm2 at −1V for a 6.4nm film). The cubic phase is stable upon postdeposition high temperature annealing at 900°C under NH3.
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Handbook of X-Ray Photoelectron Spectroscopy
J. F. Moulder · Medical Entomology and Zoology · 1995 · 23.7K citations