A New Technique for the Formation of Ultrafine Particles by Sputtering

Abstract

A gas evaporation technique using sputtering is newly developed. The characteristic of this new technique is the use of sputtering in an atmosphere of higher gas pressure such as 0.5 to 100 Torr than is used for ordinary sputtering. W, Ag and Cu are tested and their ultrafine particles are formed. WC 1- x particles are also prepared by reactive sputtering.