A Study of Contamination on Electroplated Gold, Copper, Platinum, and Palladium

Abstract

Electroplated gold, copper, palladium, and platinum have been examined for surface and bulk impurities using spark source mass spectrometry and ion scattering spectrometry. Electroplated metals were found to have more contamination on their surfaces than cast metals after the same cleaning procedures. Methods such as rinsing in distilled, deionized water or ultrasonic cleaning in trichloroethylene did little to remove surface impurities from electroplates. A mild etch followed by a distilled, deionized water rinse was found to be the most effective method for cleaning the surfaces, with the exception of the platinum electroplate. Bulk impurities indicative of plating bath contamination were found in many instances.