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Investigation of small Sn–3.5Ag–0.5Cu additions on the microstructure and properties of Sn–8Zn–3Bi solder on Au/Ni/Cu pads

Materials ScienceMaterials EngineeringEngineeringPowder MetallurgySn–8zn–3bi SolderApplied PhysicsSmall Sn–3.5ag–0.5cu AdditionsAlloy DesignElectronic PackagingMicroelectronicsMicrostructureMetal ProcessingAu/ni/cu Pads