Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 1987 · 14 citations · 0 references
EngineeringAerospace EngineeringElectrical EngineeringAvionicsOptoelectronicsSensorsDetector TechnologyDisplay TechnologiesInfrared InstrumentationMemory DevicesMemory Subsystem DesignDynamic Random-access MemoryDynamic Random-access Memory DesignInfrared Image SensorsInfrared SensorsMemory Array ArchitectureMemory Circuit DesignRandom-access MemorySilicon
A five-year independent research and development effort at Lockheed Missiles & Space Company (LMSC) has produced a multiple dynamic target simulation (MDS) technology based upon silicon structures. This technology addresses the need for realistic ground simul-ations of large numbers of objects in the testing of infrared sensors. Individually controllable blackbody radiators, analog sample and hold circuits, shift register addressing circuitry, and dynamic random access memory (RAM) circuitry, all silicon based, make up the large target plane arrays of regularly spaced emitters. This paper presents the current state of development of performance capabilities of LMSC's MDS technology, based upon measurement results. A companion paper' presents a detailed description of the techniques used to generate these structures.