Transactions of the ASAE · 1990 · 51 citations · 0 references
EngineeringAgricultural EngineeringAgronomyFinite Element AnalysisFinite Element MethodsHeat TransferFood DryingGrain Structure AnalysisHeat Transfer AnalysisHeat Transfer ModelingMoisture AnalysisMoisture Content AnalysisCoupled Heat TransportDryingGrain DryingGrain Quality EvaluationHeat Transfer In DryingMoistureMoisture TransferMoisture Transfer Modeling
A finite element formulation and solution of a set of coupled conductive heat and diffusive moisture transfer equations to improve grain drying simulation of axisymmetric bodies is presented. The model considers the temperature and moisture dependence of the diffusion coefficient, thermal conductivity, and specific heat. It assumes that moisture diffuses to the outer boundaries of the kernel in liquid form and that evaporation takes place only at the surface of grain. Application was made to drying of a barley kernel and predicted results agreed well with the experimental data. The simulated temperature and moisture profiles and gradients are directly usable for stress cracking analyses of grain. The results of the finite element analysis can be used for grain quality evaluation and drying simulation studies.