IEEE Journal of Solid-State Circuits · 1984 · 37 citations · 8 references
EngineeringComputer EngineeringElectrical EngineeringLow-power DesignMicroelectronicsSemiconductor DevicesCmos Circuit DesignComplementary Metal-oxide-semiconductor TechnologyDynamic Power ReductionIntegrated Circuit DesignMemory DevicesPower ManagementArea-delay TradeoffsFabricationFault-tolerant DesignLow-power Memory CircuitsMemory Circuit DesignPower-efficient Memory DesignStatic Random-access Memory DesignUltra-low-power Cmos
A fast, low-power 32K/spl times/8-bit CMOS static RAM with a high-resistive polyload 4-transistor cell has been developed utilizing a dynamic double word line (DDWL) scheme. This scheme combines an automatic power down circuitry and double word line structure. The DDWL, together with bit line and sense line equilibration, reduces the core area delay time and operating power to about 1/2 and 1/15 that of a conventional device, respectively. A newly developed fault-tolerant circuitry improves fabrication yield without degrading the access time. As for a fabrication process, an advanced 1.2-/spl mu/m p-well CMOS technology is developed to realize the ULSI RAM, integrating 1,600,000 elements on a 6.68/spl times/8.86 mm/SUP 2/ chip. The RAM offers, typically, 46 ns access time, 10 mW operating power and 30 /spl mu/W standby power.
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Approximation of wiring delay in MOSFET LSI
T. Sakurai · IEEE Journal of Solid-State Circuits · 1983 · 409 citations
A 64Kb full CMOS RAM with divided word line structure
Masahiko Yoshimoto, Keiko Anami, Hirofumi Shinohara et al. · 1983 · 46 citations
Engineering, Computer Engineering, Electrical Engineering +14
Satoshi Konishi, J. Matsunaga, T. Ohtani et al. · 1982 · 29 citations
Engineering, Computer Engineering, Electrical Engineering +16