Shear-enhanced adhesiveless transfer printing for use in deterministic materials assembly

Abstract

This letter describes the physics and application of an approach to transfer printing that utilizes targeted shear loading to modulate stamp adhesion in a controlled and repeatable fashion. Experimental measurements of pull-off forces as functions of shear and stamp dimension reveal key scaling properties and provide a means for comparison to theory and modeling. Examples of printed structures in suspended and multilayer configurations demonstrate some capabilities in micro/nanoscale materials assembly.