Wetting of Cu by Bi–Ag based alloys with Sn and Zn additions

Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates

Jenn‐Ming Song, Hsin-Yi Chuang, Zong-Mou Wu · Journal of Electronic Materials · 2006 · 113 citations

Natural Sciences, Materials Engineering, Materials Science +16

Studies of the Ag-In phase diagram and surface tension measurements

Z. Moser, W. Gąsior, J. Pstruś et al. · Journal of Electronic Materials · 2001 · 109 citations

Natural Sciences, Materials Engineering, Materials Science +14

Environment-Friendly Electronics: Lead-Free Technology

Journal of Electronic Packaging · 2005 · 98 citations · Full text

Engineering, Electrical Engineering, Materials Science +9

Thermal and Tensile Properties of Bi-Ag Alloys

Jenn‐Ming Song, Hsin-Yi Chuang, Tien-Xiang Wen · Metallurgical and Materials Transactions A · 2007 · 94 citations

Natural Sciences, Materials Engineering, Materials Science +10

Assessment of the M n-O System

A. Nicholas Grundy, Bengt Hallstedt, Ludwig J. Gauckler · Journal of Phase Equilibria · 2003 · 90 citations

Public Health, Computer Systems, Computer Architecture +1