Publication | Closed Access
Time dependence of interface trap formation in MOSFETs following pulsed irradiation
127
Citations
20
References
1988
Year
Electrical EngineeringEngineeringRadiation GenerationPhysicsStress-induced Leakage CurrentBias Temperature InstabilityApplied PhysicsTime-dependent Dielectric BreakdownInterface Trap FormationSingle Event EffectsPulsed IrradiationGate Oxide ThicknessRadiation PulseSemiconductor Device FabricationTime DependenceMicroelectronicsInterference TrapSemiconductor Device
The time dependence of interference trap (N/sub it/) formation in MOSFETs was studied as a function of gate oxide thickness, oxide growth type, substrate orientation, temperature, and gate bias. Two different N/sub it/ formation mechanisms are observed. Most (typically 90%) of the formation, called the late process, occurs slowly at long times (1-10000 s) after the radiation pulse. From a variety of experimental data, it is concluded that the rate of the late process is limited by drift of a radiation-induced positive ion, probably H/sup +/, through the gate oxide to the Si-SiO/sub 2/ interface where the N/sub it/ are formed. A relatively fast, or early, process is responsible for a small percentage of the total N/sub it/ formation. The time constant for this process appears to be consistent with hole drift through the oxide.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">></ETX>
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