Publication | Closed Access
Electromigration lifetimes and void growth at low cumulative failure probability
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Citations
4
References
2006
Year
Electrical EngineeringReliability EngineeringEngineeringElectromigration TechniquePhysicsDevice ReliabilityApplied PhysicsTime-dependent Dielectric BreakdownCircuit ReliabilityElectronic PackagingVoid GrowthMicroelectronicsPhysic Of FailureElectrical Insulation
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