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Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

Numerical AnalysisEngineeringMechanical BehaviorMechanicsMulti-layered Flexible ElectronicsMechanical EngineeringApplied PhysicsStressstrain AnalysisSolid MechanicsElectronic PackagingCrack FormationDynamic Crack PropagationMechanics Of MaterialsPhysic Of FailureElectrical Insulation