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The stylus or scratch method for thin film adhesion measurement: some observations and comments
94
Citations
8
References
1970
Year
EngineeringMechanical EngineeringScratch MethodThin Film Process TechnologySurface TechnologyThin Film ProcessingMaterials ScienceSurface FinishMicrofabricationMetallic FilmsSurface ScienceMaterials CharacterizationApplied PhysicsRounded StylusAdhesive MaterialScratch FormationThin FilmsSurface ProcessingStructural Adhesive
The effect of applying a rounded stylus to thin metallic films on glass substrates has been investigated using diamond and steel styli with tip radii of approximately 25 μm and loadings of up to 230 g. The films were vacuum-deposited indium, tin, lead, gold, copper, aluminium, nickel, chromium and molybdenum of various thicknesses up to 3·2 μm. Scanning electron microscope and optical interference microscope observations showed that the process of scratch formation was generally very complex and varied with the film material, indicating that it is not possible to deduce absolute values of adhesion forces using a simple general theoretical model. The method can, however, be used with caution for qualitative comparisons under certain restricted conditions.
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