Microstructure at the interface between AIN and a Ag–Cu–Ti braze alloy

Interactions of thin Ti films with Si, SiO2, Si3N4, and SiO<i>x</i>N<i>y</i> under rapid thermal annealing

A. E. Morgan, E. K. Broadbent, K. N. Ritz et al. · Journal of Applied Physics · 1988 · 123 citations

Natural Sciences, Materials Engineering, Materials Science +17

Brazing of pressureless-sintered SiC using Ag-Cu-Ti alloy

Jonas Kofi Boadi, Toyohiko Yang, Takayoshi Iseki · Journal of Materials Science · 1987 · 66 citations

Engineering, Materials Engineering, Materials Science +14

High-resolution electron microscopy of a SiC/SiC joint brazed by a Ag-Cu-Ti alloy

Toyohiko Yano, Hisayuki Suematsu, T. Iseki · Journal of Materials Science · 1988 · 63 citations

Natural Sciences, Materials Engineering, Materials Science +13

Characterization of ceramic/TA6V titanium alloy brazed joints

C. Peytour, F. Barbier, A. Revcolevschi · Journal of materials research/Pratt's guide to venture capital sources · 1990 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +8

Characterization of the AIN–W Interface in a Cofired Multilayer AIN Substrate

Yasuhiro Kurokawa, William D. Scott · Journal of the American Ceramic Society · 1989 · 20 citations

Natural Sciences, Materials Engineering, Materials Science +16