Publication | Closed Access
Impurity gettering by vacancy-type defects in high-energy ion-implanted silicon at Rp /2
25
Citations
8
References
2000
Year
Materials EngineeringMaterials ScienceDefect ToleranceIon ImplantationPoint DefectsEngineeringPhysicsPositron Annihilation SpectroscopyIntrinsic ImpurityApplied PhysicsHigh-energy Ion-implanted SiliconDefect FormationSemiconductor Device FabricationSilicon On InsulatorMicroelectronicsVacancy-type DefectImpurity GetteringVacancy-type Defects
Vacancy-type defects were studied after high-energy self-implantation of Si and subsequent rapid thermal annealing by means of a depth-resolution enhanced positron beam technique. Two different types of open-volume defects were found at a depth of Rp/2 and Rp, respectively. The defect type at Rp/2 is an agglomeration of point defects containing vacancies. This defect getters diffusing copper atoms. The vacancy-type defect observed in a depth of Rp could be connected to the interstitial loops formed there. The positron annihilation parameters suggest that this detected defect is not decorated by diffusing copper atoms.
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