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Retardation of (Cu,Ni)6Sn5 spalling in Sn–Ag–Cu/Ni solder joints via controlling the grain structure of Ni metallization layer

Materials ScienceMaterials EngineeringEngineeringMechanical EngineeringGrain StructureMetallurgical ProcessNi Metallization LayerMetal ProcessingMicrostructureSn–ag–cu/ni Solder Joints