Publication | Closed Access
Electrical Evaluation of Ru–W(-N), Ru–Ta(-N) and Ru–Mn films as Cu diffusion barriers
32
Citations
9
References
2011
Year
Materials ScienceElectrical EngineeringElectromigration TechniqueRu–mn FilmsElectrical EvaluationEngineeringDiffusion ResistanceSurface ScienceApplied PhysicsThin FilmsCu Diffusion BarriersCharge Carrier TransportElectrical Property
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